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XCVU23P-2FSVJ1760I

Part number XCVU23P-2FSVJ1760I
Product classification FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx (AMD)
Description IC FPGA VIRTEX-UP 1760FCBGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$79,655.6250

$79,655.6250

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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVirtex® UltraScale+™
PackageTray
Product StatusACTIVE
Package / Case1760-BBGA, FCBGA
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Voltage - Supply0.825V ~ 0.876V
Number of Logic Elements/Cells2252250
Supplier Device Package1760-FCBGA (42.5x42.5)
Number of LABs/CLBs128700
Total RAM Bits77909197
Number of I/O644
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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